ucie specucie specThis is the electrical interface to the package media. It handles signal transmission, link training, lane repair, and sideband communication for parameter negotiation.
UCIe defines three (pinouts) for interoperability:
As Moore’s Law slows, chiplet-based disaggregated System-on-Chips (SoCs) offer the path to higher performance, yield, and reusability. UCIe provides the "glue" to mix compute, memory, I/O, and analog chiplets from multiple sources.
A chiplet designed for UCIe-2.5D can physically mate with any other UCIe-2.5D chiplet from any vendor, provided same bump map version.
Documents available:
ucie specucie spec
S’abonner
This is the electrical interface to the package media. It handles signal transmission, link training, lane repair, and sideband communication for parameter negotiation.
UCIe defines three (pinouts) for interoperability:
As Moore’s Law slows, chiplet-based disaggregated System-on-Chips (SoCs) offer the path to higher performance, yield, and reusability. UCIe provides the "glue" to mix compute, memory, I/O, and analog chiplets from multiple sources.
A chiplet designed for UCIe-2.5D can physically mate with any other UCIe-2.5D chiplet from any vendor, provided same bump map version.
Documents available:
Formulaire web introuvable.
